- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/635 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for disengagement only by mechanical pressure, e.g. spring force
Patent holdings for IPC class H01R 13/635
Total number of patents in this class: 344
10-year publication summary
35
|
28
|
43
|
53
|
39
|
40
|
23
|
24
|
26
|
6
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Foxconn Interconnect Technology Limited | 1034 |
11 |
Molex, LLC | 1792 |
9 |
Yazaki Corporation | 6282 |
8 |
Japan Aviation Electronics Industry, Limited | 1585 |
7 |
PPC Broadband, Inc. | 1017 |
7 |
Eaton Intelligent Power Limited | 6113 |
7 |
Intel Corporation | 45621 |
6 |
Sumitomo Wiring Systems, Ltd. | 9367 |
6 |
Rockwell Automation Technologies, Inc. | 2547 |
6 |
Molex Incorporated | 609 |
6 |
Phoenix Contact GmbH & Co. KG | 2202 |
6 |
Star Bp, Inc. | 22 |
6 |
Aptiv Technologies AG | 2097 |
6 |
ZTE Corporation | 39218 |
5 |
HARTING Electronics GmbH | 118 |
5 |
TE Connectivity Solutions GmbH | 2580 |
5 |
Hewlett-Packard Development Company, L.P. | 28538 |
4 |
Amphenol-Tuchel Electronics GmbH | 196 |
4 |
TE Connectivity Germany GmbH | 655 |
4 |
TE Connectivity Corporation | 462 |
4 |
Other owners | 222 |